Views: 0 Author: Site Editor Publish Time: 2024-08-16 Origin: Site
On August 13th, Tesla CEO Elon Musk and former U.S. President and Republican presidential candidate Donald Trump held a live-streamed conversation, attracting around 2 million viewers. During the more than two-hour live stream, Trump used a magnetic power bank from the Chinese brand Anker to charge his phone, which sparked heated discussions both domestically and internationally. Following this, people rushed to purchase the same product featured by Trump on major e-commerce platforms. As a result, on August 13th, Anker's stock surged, even hitting the daily limit, attracting widespread attention from the market.
On August 15th, ChargerLAB released a teardown report of the same power bank used by Trump. After opening the casing along the seam, it was revealed that the inside of the shell featured a graphite thermal pad and aerogel insulation. In June 2023, ChargerLAB had also disassembled another power bank—a 20,000 mAh 20W fast-charging power bank—and discovered that beneath the PCBA module, a layer of graphite thermal pad was adhered, and below the graphite pad was aerogel insulation, used for heat dissipation and preventing localized overheating.
When electronic devices and related charging accessories are in use, heat generation is a common issue. If not addressed properly, it can lead to poor performance or even cause malfunctions, and in extreme cases, could result in fire or explosion, posing a risk to users' safety and property. This is why both upstream and downstream industries pay close attention to this issue. The heat management process runs through the entire product development cycle. Chip manufacturers can reduce heat by improving design techniques or enhancing system architecture. Additionally, providing enough internal space to avoid heat buildup, applying thermal gel, thermal pads, and heat sinks between components, or adhering graphite thermal stickers or aerogel insulation to the outer shell can better transfer heat and reduce temperature.
By applying aerogel insulation to the product shell, the surface temperature can be reduced by more than 5°C, optimizing product performance and enhancing user experience. Aerogel can solve the heat dissipation issue in the confined spaces of electronic products and provide thermal protection for heat-sensitive components, thus improving the performance and lifespan of electronic devices, while also increasing user comfort.
